docs: cm4: mark SPI Flash as unsoldered (未焊接) - #2090
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Milir-Radxa merged 1 commit intoSep 4, 2026
Merged
Milir-Radxa merged 1 commit into
Milir-Radxa merged 1 commit into
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CM4 does not ship with SPI Flash populated. Clarify the interface diagram annotation in both zh and en to avoid misleading users into expecting an available SPI NOR flash (e.g. for bootloader storage). Source: internal hardware confirmation from Wu Minlong (2026-09-04).
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背景
CM4 接口说明图中标注了 ④ SPI Flash，但实际出货的 CM4 板上没有焊接 SPI Flash，仅作焊盘/预留位标注。用户按图例可能误以为板载 SPI NOR 可用（例如用于存放 bootloader 与 eMMC 同时使用）。
来源：2026-09-04 内部硬件同事确认（售后技术支持群）。另经硬件确认：SPI Flash 与板载 eMMC 互斥，不可通过自行补焊同时使用。
修改
docs/som/cm/cm4/README.md：④ SPI Flash → ④ SPI Flash（未焊接）docs/som/cm/cm4/hardware-use/hardware_info.md：④ SPI Flash → ④ SPI Flash（未焊接）中英文同步修改，docs-only，共 4 个文件。
影响
避免客户/开发者误以为 CM4 板载 SPI NOR Flash 可用（或可自行补焊使用），减少对启动介质与 bootloader 存放方式的误解。